Total 300 quality control engineer job vacancies in Singapore

As a Wet Chemical and Specialty Chemical Global Supplier Quality Engineer, you will be responsible to support the overall metrological alignment strategy, execution plans and excursion prevention programs to develop Suppliers through Continuous Improvement Programs to ensure advance metrology is constantly applied to materials procured materials/services to Micron. You will work in close partnership with key stakeholders such as Global Quality, Global Procurement, Global Manufacturing Central Team (MCT), Operations, Product Engineering and R&D to develop, execute and measure the effectiveness of Supplier Programs.

In addition, you will support Supplier Performance Reviews to ensure suppliers receive timely and accurate supplier performance feedback based on consistent metrics and that the expectation of continuous improvement is understood and realized. The position will be reporting to Principal Lead, Front End Supplier Engineer.

Role Responsibility and Tasks

1. Development Phase - Sourcing, Selection and Qualification Phase

• Drive Wet Chemical and Specialty Chemical Quality risk assessment and ensure all risks are mitigated to support Fabs qualification activities.
• Participate, support, and recommend from quality perspective on global sourcing and segmentation strategies, including business continuity, benchmarking, new markets, request for quotation (RFQ)/ request for information (RFI), sourcing, selection, cost savings and other analytics.
• Lead technical risk assessment audit for new supplier/ material engagement or qualification to assess their capability and readiness for High Volume Manufacturing (HVM).
• Set up, communicate, and ensure suppliers understood and comply with Micron Supplier Requirements Standards (SRS).
• Support cross fab technology transfer activities in terms of new technology Bill of Materials (BOM) and driving global specifications alignment.
• Collaborate with Suppliers on their outgoing analysis capability to align Best-In-Class (BIC) method detection.
• Align and guide Suppliers to aligned Fab’s advance technology needs which include but not limited to:Study BIC test analysis method and align with Supplier with the collaboration with site Chem Lab to support manufacturing needs (FOAK eval, routine quality monitoring, troubleshooting, improvements, etc.).
  Align, correlate, document with suppliers on lab methods / tools / practices and target to achieve low detection at ppq level contamination.
  To provide a platform for technical or knowledge sharing for SQE team.
  Conduct Regular Technical Meetings with Suppliers on metrology CIPs.
  Conduct constant look out of advance chemical analytical equipment and technology, work with internal site/supplier on results correlation and deploy into CIP with suppliers in compliance to advance technology
  Conduct research for ≤ 10nm particle detection and work with internal site/supplier on results correlation, and deploy into CIPs with suppliers in compliance to advance technology
  Lead Suppliers towards ISO17025 compliance.
  
• Set up, communicate, and ensure suppliers understood Micron metrology expectations.
• Support Category Strategy for Benchmark to/with Suppliers to ensure Controls and Preventive measures are in place to support Shift-Left-Strategy. Supplier/Material development programs.
• Participate and support test method benchmarking and analytics with Suppliers

2. HVM Phase - Supplier Development and Excursion Management

• Lead Wet Chemical and Specialty Chemical Global Material Specification definition and alignment activities with internal stakeholders and suppliers.
• Deploy Wet Chemical and Specialty Chemical category Quality programs, lessons learnt and benchmark to/ with suppliers to ensure controls and preventive measures are in place to support Shift-Left-Strategy.
• Host regular Quality and Technical Review (QTR) meetings with strategic and developing suppliers.
• Manage supplier and sub-supplier changes in Supplier Change Management (SCM).
• Work collaboratively with Global OCT MTE, Operations and Facility globally for deep dive root cause investigations, corrective and preventive actions to ensure no recurrence of related Quality issues.
• Define, manage, and monitor supplier monthly quality performance metrics and their compliance to Micron SRS.
• Enhance the supplier quality business processes to improve productivity and efficiency.
• Support Global Procurement on supplier performance rating on Quality related criteria.
• Lead and conduct supplier audit.

Required:

Bachelor's Degree on engineering or related field.

Desired:

Master's Degree on engineering or related field.

Experiences:

• Previous experience working in Chem lab, wet chemical and specialty chemical under semiconductor industry field is preferred
• Basic Knowledge of ISO9001, IATF16949 & ISO17025 requirements.
• Basic knowledge of Wet Chemical and Specialty Chemical applications and wafer manufacturing process.
• Strong analytical skills with experience in MSA and calibration, statistical methods, FMEA, problem solving methodology and quality management systems.
• Ability to interact effectively with internal and external interested parties, across all levels.
• Ability to collaborate effectively with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.

Qualification:

• Minimum of 5 years’ in semiconductor field.

Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary. Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed. May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations. Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

As the Global FE Layout Senior Engineer at Micron Technology, Inc., you will be part of Micron’s Global Factory Automation team which is responsible for designing Micron’s next generation manufacturing facilities.

Your objective is to develop full factory tool layout models that will be the basis of design for industry leading manufacturing facilities across the globe. You will be part of a diverse group of highly skilled layout professionals who are responsible for tool layout design, construction design support, and the layout business process. In addition, you will partner with Micron’s Technology Development team to develop innovative semiconductor production tools that deliver word-class, trail blazing, capabilities that solidify Micron’s manufacturing leadership.

Primary Responsibilities

• Generate Layout models for Micron’s U.S. manufacturing sites that meet or exceed established critical metric targets.
• Establish Layout requirements during Micron’s quarterly business plan reviews.
• Collect and analyze Layout date for Micron’s manufacturing sites to find opportunities for improvement, recommend design changes, and identify new processes that will improve Micron’s overall manufacturing efficiency.
• Maintain a Layout data repository (SharePoint) that can be demonstrated for historical validation as well as information sharing across multiple departments.
• Collaborate with the Technology Development team to influence the design of future process equipment that enable improved space efficiency.
• Actively engage and contribute to Micron’s environmental sustainability projects.
• Present your layout designs and recommendations to Micron’s Senior Leaders and Executive team.

Requirements

• Bachelor’s Degree in related field or equivalent professional experience (MS Degree Preferred)
• Five years’ specific and confirmed experience
• Expert proficiency using AutoCad, BIM, Revit, Factory Design Utility and other similar Layout software applications.
• Direct experience with process equipment and facilities design.
• Fluent in English both verbal and written.

Working Location : Micron Fab10

Job Responsibilities

• Disposition of Fab lots affected by planned or unplanned deviations (including those from Special Work Requests and Fab Conversions, or from Quality Deviations and Excursions).
• Work closely with Fab partners to identify and contain excursion material. Initiate and lead multi-functional MRB (Material Review Board) to conduct risk assessment and decide upon disposition of excursion material.
• Review and analyze proposed process conversion changes to ensure that the proposed manufacturing changes conform to current business standards, improve Micron’s competitiveness in terms of wafer yields and costs, and protect Micron’s product quality.
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products.
• Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations.
• Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary.
• Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed.
• May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations.
• Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

Requirements

• Bachelor's Degree in Electrical or Chemical Engineering, Material Science, Physics and 3+ years of semiconductor industry experience
• Knowledge of Electrical and Physical Failure analysis of semiconductors
• Knowledge of semiconductor memory product and reliability testing
• Strong understanding of NAND FLASH operation and structure
• Intermediate understanding of wafer fab manufacturing process steps, functional probe and parametric testing methodologies
• Excellent statistical data analysis, troubleshooting and decision making skills
• Proven track record to work effectively in both an independent role and in team environments
• Excellent multi-tasking and problem solving skills
• Intermediate PC skills including MS Office Word, Excel and PowerPoint
• Ability to clearly communicate data and findings both verbally and in writing.

As a Senior DDQA (Development and Design Quality Assurance) CMOS Reliability Engineer, you will be primarily responsible for developing and optimizing quality and reliability criteria related to CMOS process for the next generation of Micron's memory parts. You will be partnering with Technology Development (TD) on latest products and technologies related to CMOS Front end/interconnect module and define quality and reliability fail modes especially NUDD (New, Unique, Different, Difficult) with goal to mitigate risk and achieve product qualification milestone successfully. You will also be required to identify, diagnose, and resolve CMOS related problems by applying failure analysis, FMEA or 8D methodology. In this position, you will be working in a highly collaborative atmosphere, interacting with various groups such as Technology Development (TD), Process Integration, electrical and physical failure analysis, Product Engineering, Quality Reliability Assurance Team to develop product that meets Quality and Reliability specs and requirements.

Responsibilities include, but not limited to:

• Drive new CMOS devices or modules for the future technology of NAND from Product Quality and Reliability perspective.
• Define & implement Reliability test methodology for validating the risk of new CMOS module for the next generation of Micron's memory parts.
• Provide insights and guidance to the Global Quality (GQ) management team on topics involving CMOS.
• Interact and collaborate with Design Team, TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Develop/re-define inline and electrical critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Characterize and validate new CMOS device, models, and test structures for developing future NAND products.
• Develop, establish new CMOS Param or optimize scribe design for CMOS parameters.
• Collaborate with various stakeholders and provide DDQA independent assessment on Quality & Reliability items in various technology development milestones (EPP, SVC, MSC, VME), escalate issues and collaborate for timely risk mitigation and resources, also provide inputs for Leaderships in making decision on passing the Qual milestone (Low Tier Qual/High Tier Qual/Auto Qual etc).
• Support technology transfer to production facilities (some international travel may be required).
• Partner with multiple stakeholders in Process Conversion Review Board Meeting (PCRB) to improve coverage from various aspects of product quality and reliability and prevent post qual escapes or excursion triggered by conversion.
• Identify gaps and drive initiatives/programs/business process to build margin around structural, electrical, and reliability performance.
• Build Product Fail Modes Repository based on NUDD (proactive) and previous issues (reactive), and work with key stakeholder to prevent issues or implement effective detections controls and containment.
• Deliver a new Product Fail Modes Repository and their Effective Detection Controls and Containment Document to meet technology development and Transfer timeline.
• Partner with Manufacturing (MFG) or Central Quality teams on current high-volume products to sustain and further develop the Product Fail Modes Repository through regular refresh meeting.

Minimum Qualifications:

• 4+ years’ experience in semiconductor related engineering.
• Hands-on experience on advanced CMOS engineering and device reliability, integration or characterization, specialized in Microelectronics and Semiconductor Device Physics is a requirement.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Understanding of Reliability items for CMOS and Array
• Understanding of electrical specifications, Probe and Param registers
• Knowledge of 3D NAND Fab processes, flow and common reliability and yield fail modes is preferred.
• Highly skilled at problem-solving activity and capability of leading cross functional team.
• Understanding on technical risk assessment, FMEA, and 8D methodology for root cause analysis and problem solving.
• Effective verbal and written communication skills in English.
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment.
• Ability to work independently, with minimal direction, and a focus on meeting commitments.
• Real passion for improving product quality to increase customer satisfaction.

Education and Experience:

• Bachelor’s degree or higher in electrical or electronics engineering, physics, chemistry, mechanical engineering, material science, or other applied engineering discipline.

As a FE Global PLN Strategic & Modeling Engineer at Micron, you will have a unique opportunity to contribute to Micron's strategic goals and company growth by providing business planning support and forming modeling approach to analyze strategic scenarios. You will collaborate closely with various teams including Network Planning, Market Intelligence, Supply Chain, Finance, Procurement, and TD to understand different information and metrics that affects our loading plan and translating them into structured model to support analysis and decision making.

Responsibilities:

• Understand high-level factory limitations and benchmarking to determine the most efficient capital utilization.
• Demonstrate expertise in computer, and Microsoft Office skills to extract data and develop executive presentations effectively. Expertise in planning systems and applications will be a plus.
• Support capacity studies for special projects such as site selections for future fab expansions and new emerging product deployments.
• Apply industrial engineering concepts to model the capacity thresholds to support existing and future technology
• Efficiently manage capital expenditure scenarios and cash flows through comparison and optimization.
• Collaborate with the finance team to perform comprehensive financial analysis across different scenarios, which includes evaluating manufacturing costs, payback period, Net Present Value (NPV), and Profit/Loss (P/L) analysis.
• Provide and evaluate scenario options to improve financial bottom line.

Requirements:

• Required: Bachelor's degree in Industrial Engineering, Production Operations Management, Information Systems, Computer Science, Process Engineering, or equivalent experience in the field.
• Minimal 2 years experiences in Semiconductor Industry, or other Industry planning modeling equivalent function experience.
• Knowledge and practical application of statistics, data analysis, and problem-solving.
• Knowledge of Manufacturing Science, including lean manufacturing, factory constraints, and other relevant factors.
• Experience working collaboratively in diverse teams.
• Strong focus on meeting the operational needs of the Fabs and effectively communicating those needs to different parties involved.
• Ability to influence decision making in various team meetings.
• Ability to communicate effectively through multiple levels of management and organizations.
• The ability to multi-task efficiently.
• Willingness to work flexible hours as required.
• Strong written and verbal communication skills.

As an Inline and Final Parametric test program development engineer, you will be responsible for developing, maintaining, and optimizing Parametric test programs and strategies for semiconductor NAND Flash products. You will work closely with various engineering teams to ensure the quality, reliability, and performance of the products. You will also provide innovative solutions for test time reduction and test flow optimization.

Job Responsibilities

• Develop and maintain parametric test strategies and programs for semiconductor NAND Flash products
• Collaborate with test development and production engineering groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing
• Improve device yield, reliability and quality through test condition optimization and data analysis and test equipment hardware optimization
• Provide cost effective and innovative solutions for production test flow optimization with cutting-edge Parametric test time reduction methodologies.
• Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations.
• Introduce innovative test time reduction solutions and release Parametric programs to production in a timely manner.

Job Requirements

• Bachelor’s or Master’s Degree in Electrical, Electronics, Computer Engineering, Computer Science or any related engineering field
• Strong programming skills; Perl, C/C++, Python knowledge will be an added advantage.
• Knowledge of Unix/Linux System environment
• Solid analytical problem-solving skills
• Excellent verbal and written communication skills
• Good understanding of semiconductor device physics will be an added advantage
• Fresh graduates are most welcome to apply

Working Location :

1, North Coast Drive, Singapore 757432

About Micron

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form

Keywords: Singapore || North West (SG-03) || Singapore (SG) || Frontend Manufacturing || College || Regular || Manufacturing/Production Operations || #LI-ST1 || Tier 3 ||

Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.

Job Responsibilities

• Provide leadership in wire bond technology, problem analysis and resolution
• Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
• Process Development & Characterization, Qualification, and production pilot run
• Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
• Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
• Qualify and transfer packaging technology to production site
• Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
• Showcase and build organization reputation by publishing technical papers and submit invention disclosures.

Job Requirements

• PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
• At least 5 years of experience in semiconductor wire bond engineering
• Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams

Keen on the role? Apply with us now!

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

As a Central Planning Modeling Engineer, you will be a central contact for the manufacturing network, calculating and communicating capital impact of process changes to senior leaders in Manufacturing and R&D . You will be responsible for connecting many parts of the business in order to drive the execution of manufacturing and cost saving processes, including supply change, finance, engineering, procurement, production and planning. Innovation is highly valued at Micron, and you will have the opportunity to develop new tools to expedite, optimize and refine the planning and reporting processed used across the network. The ability to understand and effectively communicate the capital and operational impacts of manufacturing changes is essential. Attention to detail and ability to work in where information is ambiguous will be extremely valuable

Your Responsibilities will include but are not limited to :

• Manage network tool utilizations strategies and benchmark performance to optimize the company’s deployed capital
• Manage and communicate improvement and implementation plan to all relevant levels and functions in Manufacturing
• Optimize capacity of install equipment and lead sites and tool level optimization studies for throughput enhancement
• Collaborate with partners to understand future tool and process roadmaps. Able to assess network capacity impacts of process changes
• Improve financial analyses before capital equipment are purchased through automating metrics optimizations, process flexibility, capacity sharing and equipment repurpose
• Attention to detail and ability to work in situations where changes is fluid
• Ability to spot, question and highlight differences to drive resolutions with relevant stakeholders

Qualifications

• Bachelors’ Degree in Engineering, Computer Science, or a Business-related or quantitative field (Finance, Economics or similar discipline). MBA or Master’s degree is a plus
• Experience turning complex and ambiguous problem statements into structured solution while working in a highly multi-functional environment
• Experience operating independently while maintaining a high degree of organization, control and change management
• Experience analyzing and interpreting data, drawing conclusions, defining recommended actions, and reporting results cross diverse technical and non-technical groups
• Experience working in teams, establishing and maintaining multi-functional relationships
• Experience in a combination of capacity analysis, business analysis or process analysis is advantageous

As a Central Planning Modeling Engineer (Analytics), you will be a central contact for the manufacturing network. You will be responsible for connecting many parts of the business in order to drive the execution of manufacturing and cost-saving processes, including supply change, finance, engineering, procurement, production, and planning. Innovation is highly valued at Micron, and you will have the opportunity to develop new tools to expedite, optimize and refine the planning and reporting processes used across the network. The ability to understand the challenges and effectively communicate and collaborate with peers across the network to develop solutions to address those challenges is essential. Attention to detail and ability to work in where information is ambiguous will be extremely valuable.

Your responsibilities will include, but are not limited to:

• Applying coding techniques (e.g., Python, VBA, SQL) to automate tasks, build and implement tools and dashboards in collaboration with partners to audit current planning processes and uncover cost reduction opportunities.
• Demonstrating strong project management skills to oversee, communicate, and coordinate the implementation of automated solutions, ensuring timely and successful completion of tasks.
• Driving benchmarking and alignment strategies to optimize planning processes across the network

Requirements:

• Experience in developing reports and solutions.
• Attention to detail and the ability to turn complex and ambiguous problem statements into structured solutions.
• Proven ability to analyze and interpret data, draw conclusions, identify issues, recommend actions, drive resolutions, and report results.

Responsibilities :

• Collaborate with Production, Equipment, Shift Engineering, Process Integration and other Process Areas in day-to-day tasks
• Analyze process data and conduct experiments to optimize process conditions
• Design and implement advanced process monitoring and control methodologies
• Troubleshoot process failures and implement robust and effective solutions to address process and equipment issues
• Participate and lead cross module team in process and yield improvement meeting to help improve overall yield of the product
• Develop procedures and checklists for maintenance, equipment or process qualification and reaction mechanisms
• Initiate and execute process improvements contributing to overall manufacturing productivity and cost competitiveness
• Utilize project management fundamentals for project development, tracking and closure
• Participate in quality focused meetings to help the area reduce scrap and excursions, improve quality and maximize yield

Requirements :

• Master/Bachelor Degree in Chemical/Electrical/Mechanical Engineering, Materials Science, Chemistry & Physics

Working Location :

1, North Coast Drive, Singapore 757432 / 1, Woodlands Industrial Park D, Street 1, Singapore 738799

About Micron

As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to demonstrate the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords: Singapore || North West (SG-03) || Singapore (SG) || Frontend Manufacturing || College || Regular || Engineering || Not Applicable ||

Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.

As a Manufacturing Engineer at MSB, you will be responsible for executing area resource plans in terms of logistics and indirect piece parts and managing, developing employee performance.

In this role some of the tasks that need to carried out include exploring continuous improvements activities to assist area management in running the production in a cost efficient and effective manner. You will need to forecast unplanned or ad-hoc staffing and training needs, monitor area performance and provide performance feedback, mentoring, and career development where appropriate.

Other responsibilities include ensuring a safe work environment by performing regular work area inspections and conducting timely event investigations. You will be working with various engineering and manufacturing groups throughout the company.

Requirements

• Bachelors / Masters in Mechanical Engineering, Mechatronics Engineering, Electrical and Electronics Engineering, Materials Engineering, Industrial & Systems Engineering, Chemical Engineering or related field.
• Has leadership experience and potential
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations
• Background in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals will be beneficial

Keen for the role? Apply now!

Develops, implements and maintains methods, operation sequence and processes in the manufacture or fabrication of parts, components, sub assemblies and final assemblies. Interfaces with design engineering in coordinating the release of new product. Estimates manufacturing cost, determines time standards, and makes recommendations for tooling and process requirements of new or existing product lines. Maintains records and reporting systems for coordination of manufacturing operations.

As a Firmware Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, and help the development teams with isolating issues.

Key Responsibilities:

• Develop and execute validation test plan on SSD devices on PC systems
• Design, develop, implement test cases required to validate Automotive SSD
• Work with Automotive customer systems and the automotive operating systems
• Analyze and writes test standards and procedures
• Maintain documentation of test results to assist in debugging and modification of software
• Analyze test results to ensure existing functionality, recommends and implement test coverage improvement actions
• Perform Failure analysis and work with other function groups to resolve SSD system issues
• Provide system analysis support for customer or yield related issues
• Improve customer integration experience

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering
• Knowledge and experience with embedded firmware development
• Expertise in the use of scripting languages, programming tools and environments
• Extensive experience programming in Python
• Experience in the storage industry in SSD, HDD, storage systems, or a related technology
• Understanding of storage interfaces including ideally PCIe/NVMe, SATA, or SAS
• Experience with NAND flash and other non-volatile storage
• Ability to work independently with a minimum of day-to-day supervision
• Experience with team leadership and/or supervising junior engineers and technicians
• Ability to work in a multi-functional team and under the pressure of multiple priorities

As a Product Engineer at Micron Technology, Inc., you will be responsible in developing, validating, characterizing, and qualifying new state-of-the-art NAND Flash memory products. In this role, you will be involved in pre-silicon conceptual design and preparation work, run simulations, create and maintain design and validation documentation, analyze bench and parametric data as well as to debug & resolve yield, quality and reliability failures due to design related issues. You will also refine and develop best known methods and automation for design validation of current and future products.

Key Responsibilities:

• Responsible for in-depth data analysis to look for sighting that is detected from reliability testing on certain cell marginality.
• Develop state-of-art and advanced algorithms, encompassing advanced models to boost and enhance data-mining and pattern recognition for quality and yield improvement.
• Work with Product/Fab/Engineering teams on product issues (yield/cell/qualification/defectivity/RMA/deviations) in problem analysis, data-mining and modeling, to provide optimal disposition solution.
• To develop state-of-art and advanced algorithms, encompassing Machine Learning and Deep Learning models to boost and enhance data-mining and pattern recognition for quality and yield improvement.
• Collaborate with cross functional team to translates functional specifications into technical designs for implementation and deployment.
• Setup data processing systems to facilitate access to cloud/on-prem database and identify opportunities for improvements and optimization.
• Work with IT team and vendor to enable cloud platform in Micron environment and optimized GCP cost.
• Develop tailored made machine learning solution and collaborate with TPG data science team to translate idea to data science prototypes.
• Continuous improvement on software build by investigating alternatives and technologies in support of systems development efforts.

Requirements:

• Bachelor's/Master's in Electrical/Electronic Engineering, Computer Engineering, Computer Science, Data Science.
• Proficiency in software development (e.g., C-based programming) and scripting (e.g., Perl, Python).
• Knowledge of Machine Learning/Deep Learning methodology.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems.
• Effective communication skills in written and spoken English.
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment.
• Self-motivation and enthusiasm

As a Product Yield Analysis (PYA) ESDA Engineer at Micron Technology, Inc., your primarily responsibilities will be setup ESDA for new products, maintain and enhance ESDA systems, drive alignment across fabs on how ESDA data is collected, stored, analyzed and reported. Additionally, you will be responsible for communicating and coordinating ESDA activities with various Departments (Design, Product Engineering, Test, YE, RDA and IT).

ESDA (Enhanced Software for Defect Analysis) is the system used at Micron Technology, Inc., to categorize fails coming from the tester based on their pattern, size and location within the die. ESDA is used to identify defects detected during wafer fabrication responsible for tester fails as well.

Key Responsibilities:

ESDA setup for new products

• Ensure ESDA is available for all DRAM and NAND parts before first Silicon reaches Probe.
• Verify that setup is correct and ESDA data is available to YE groups.
• Enable ESDA on new technology and new test data.

Maintain ESDA System

• Monitor Micron’s current ESDA system for problems in its ability to collect complete and accurate data in a timely fashion.
• Be a central point of contact for customer problems with ESDA.
• Identify root cause of ESDA problems quickly and solve or contact and work with responsible department to solve.
• Forecast future needs for ESDA system and be pro-active in addressing.

Improving ESDA System

• Identify opportunities to leverage ESDA data for yield improvement and reliability improvement.
• Improve ability to use ESDA for defect matching for feedback to RDA and YE.
• Create Engineering software tools for ESDA analysis and product line monitoring.
• Work with FA groups on tactical issues involving ESDA analysis to understand current usage.

Alignment

• Drive for alignment across fabs on how ESDA data is collected, stored, analyzed and reported.
• Help in establishing common company-wide criteria for measuring performance of ESDA system.
• Work with other departments/sites on prioritizing ESDA related projects (with timelines and deliverables).
• Facilitate meetings across departments to get input and consensus on improvements/fixes to ESDA.

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering or equivalent.
• Experience with memory products in one or more of the these areas: Product Engineering / Product Test / Product Design / Product Yield Enhancement
• Proficiency in at least one programming language, preference for C, C++, Python.
• Familiar with OOP concepts and implementation.
• Familiarity with web development beneficial (html, javascript, css, Angular)
• Familiar with Unix Shell environments
• Familiar with source control (Git, Jira, Jenkins).
• Excellent problem-solving and analytical skills.
• Ability to work in a fast-paced environment and communicate effectively (written and verbal) across multiple locations and teams.
• Strong skills in communicating complex technical ideas/concepts.

As a Product Yield Analysis (PYA) ESDA Engineer at Micron Technology, Inc., your primarily responsibilities will be setup ESDA for new products, maintain and enhance ESDA systems, drive alignment across fabs on how ESDA data is collected, stored, analyzed and reported. Additionally, you will be responsible for communicating and coordinating ESDA activities with various Departments (Design, Product Engineering, Test, YE, RDA and IT).

ESDA (Enhanced Software for Defect Analysis) is the system used at Micron Technology, Inc., to categorize fails coming from the tester based on their pattern, size and location within the die. ESDA is used to identify defects detected during wafer fabrication responsible for tester fails as well.

Key Responsibilities:

ESDA setup for new products

• Ensure ESDA is available for all DRAM and NAND parts before first Silicon reaches Probe.
• Verify that setup is correct and ESDA data is available to YE groups.
• Enable ESDA on new technology and new test data.

Maintain ESDA System

• Monitor Micron’s current ESDA system for problems in its ability to collect complete and accurate data in a timely fashion.
• Be a central point of contact for customer problems with ESDA.
• Identify root cause of ESDA problems quickly and solve or contact and work with responsible department to solve.
• Forecast future needs for ESDA system and be pro-active in addressing.

Improving ESDA System

• Identify opportunities to leverage ESDA data for yield improvement and reliability improvement.
• Improve ability to use ESDA for defect matching for feedback to RDA and YE.
• Create Engineering software tools for ESDA analysis and product line monitoring.
• Work with FA groups on tactical issues involving ESDA analysis to understand current usage.

Alignment

• Drive for alignment across fabs on how ESDA data is collected, stored, analyzed and reported.
• Help in establishing common company-wide criteria for measuring performance of ESDA system.
• Work with other departments/sites on prioritizing ESDA related projects (with timelines and deliverables).
• Facilitate meetings across departments to get input and consensus on improvements/fixes to ESDA.

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering or equivalent.
• Experience with memory products in one or more of the these areas: Product Engineering / Product Test / Product Design / Product Yield Enhancement
• Proficiency in at least one programming language, preference for C, C++, Python.
• Familiar with OOP concepts and implementation.
• Familiarity with web development beneficial (html, javascript, css, Angular)
• Familiar with Unix Shell environments
• Familiar with source control (Git, Jira, Jenkins).
• Excellent problem-solving and analytical skills.
• Ability to work in a fast-paced environment and communicate effectively (written and verbal) across multiple locations and teams.
• Strong skills in communicating complex technical ideas/concepts.

As a NAND System integration Lead (SIL) in the NAND Product Development Team at Micron Technology, you will be responsible for integrating Micron's leading edge NAND products into end-system requirements.

You will act as the NAND development representative and point of contact to drive NAND development swimlane requirements (SCD) to meet end-systems requirements. With the understanding of both NAND and System capabilities, you will set product development priorities and manage new change initiatives requests to enable strong agility to meet the fast-changing customer needs.

You will lead the cross-functional development team to navigate challenges and create solutions to ensure NAND solutions work within the boundary of development schedule, risks and incremental development costs for execution.

Key Responsibilities :

• Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD)
• Work together with MAG / System Architecture / BU/ Apps/ TD to resolve any gaps between NAND commit and system requirements
• Represent NAND team in System PDTs and collaborate for changes required to achieve competitive systems
• Manage NAND milestone and sample delivery schedules, in sync with system development timeline
• Own capability benchmarking for all NAND sample deliveries. Provide System development teams with relevant documentation, and drive meetings to garner approval from stakeholders
• Understanding sample usage / potential conflicts with requirements, Coordinate mitigations with system team, MAG, TD, NAND PE, to develop workaround
• Review cell changes / coordinate system integration details (Delivery, Firmware compatibility)
• Drive collaboration between NAND, MAG, and System teams to find solutions for NAND-System finds/gaps
• Communicate proper priorities within NAND Development team to maintain focus on achieving system specs and highlight concerns to both Component and System teams for any issues
• Manage communication with system teams regarding any NAND ES / QR capability issues. Assist with risk assessment for any identified issues
• Own resolution and communication on issues with NAND System Integration

Requirements

• Bachelor’s, Master’s or PhD in Electrical Engineering, Computer Engineering, Physics, or related disciplines
• Keen interest in working in a diverse, global cross-functional engineering environment with development focus
• Desire to develop knowledge and expertise in overall NAND to System development and good knowledge of NAND device/design
• Good knowledge of system firmware/design/media management is not a pre-requisite, but would be an added advantage
• Prior experience in leading product development projects or acting in similar capacity would be of added advantage.
• Good multitasking and organizational skills, excellent problem-solving skills, strong presentation skills, strong self-motivation and enthusiasm

As a Non-Volatile Engineering (NVE) Product Engineer at Micron Technology, Inc., you will be responsible to prepare for new non-volatile products and coordinate resources, testing, and analysis over the lifecycle of the product. In this role, you will work with various Engineering and Manufacturing groups to troubleshoot, develop and validate device testing programs, as well as identify and validate lab equipment needs, and identify or modify tests for customer returns and programs to meet specific product requirements. Specifically, as a member of the Engineering Tester Development team, you will enable Micron's engineering teams to analyze and debug non-volatile memory products quickly and reliably.

You will partner with Micron engineering groups to plan and develop bench testing capability; respond promptly to feedback from engineers on enhancements and defects; work proactively to advance the tools we maintain through innovation and careful design; anticipate future testing challenges and drive cost effective solutions. Finally, you will continuously improve our processes, striving for the highest quality and efficiency.

Key Responsibilities :

• Prepare bench programs, software tools, and hardware interfaces for initial silicon for new non-volatile semiconductor memory products
• Process and implement special requests for enabling silicon debug throughout the product lifecycle
• Verify that bench software and hardware implementation meets expectations for accurately and efficiently testing the product
• Partner with Engineering, Manufacturing, and Tester Vendors
• Provide technical training and expertise on Bench software applications
• Propose, evaluate, and implement long term projects for continuous improvement of bench capability

Requirements :

• Bachelor's degree in Electronics or Computer Engineering
• Proficiency in Python/Perl and C/C++ Programming Language
• Knowledge in semiconductor fundamental
• Experience with lab equipment, such as oscilloscope, logic analyzer is a plus
• Effective communication skills in written and spoken English, including documentation and presentation
• Ability to prioritize tasks based on clarifying input from multiple stakeholders
• Excellent problem solving and analytical skills, with careful attention to root cause
• Strong programming aptitude
• Self-motivated, self-disciplined, and enthusiastic
• Proactive attitude towards continuous improvement and self-development
• Strong value on customer enablement, including clarifying true needs and over-communication of status
• Strong value on following a global team oriented strategy, including backup coverage and load balancing

Overview / Responsibilities

The Facilities Cost Benchmark is responsible for developing a comprehensive construction cost and management to achieve long-term Micron goals.

The role will be managing and supporting Micron construction projects cost from planning through closeout, including scoping, pre-planning, design, construction administration, Facilities budget cost benchmark management with different Micron site.

Responsibility includes budget cost managing & improving of new project planning business process. Gathering, analyzing & benchmarking Micron current manufacturing sites & construction projects, providing accurate & timely information to project evaluation team. Facilities Cost Benchmark also has another important responsibility is to evaluate the global semiconductor factory construction cost comparison.

Responsibilities

• Manage and lead new construction project cost process.
• Establishing project objectives, scope and deliverables in collaboration with stakeholders and ensuring alignment with requirements.
• Prepare new project Cost & schedule report & long-term plan reports for management review.
• Developing and managing initial project schedules, budgets and resource allocations to ensure cost efficiency and timely delivery.
• Maintain effective communication with project team members and relative stakeholders to provide project updates, address concerns and foster strong working relationships.
• Ensure Roles, Responsibilities and Accountabilities are fully understood by the participated teams
• Collect, classify, evaluate data and information used in supporting the new Micron construction project planning evaluation request.
• To evaluate the global semiconductor factory construction cost comparison.

Skills / Qualifications

Minimum Qualifications:

• The candidate should possess a BSc or Beng in Engineering from a recognized institute of higher learning.
• Experience in Master planning & project planning is thus highly valued.
• Candidates with experience in facilities operation & construction.
• Minimum 5 years of budget and cost management experience.
• Good analytical skills with problem solving aptitude.
• Skills in excel and simple code writing desired.
• Ability to integrate and work in a global multicultural team
• Great leadership, interpersonal skills and team building spirit.
• Excellent communication skills, both written and verbal.

Minimum Experience & Skills:

• Candidates with experience in Fab or facilities construction and operations.
• Demonstrable experience in the construction or semiconductor project cost management and/or other relevant industries is strongly preferred.
• Strong financial understanding and experience in project budgeting and cost control.
• Strong communication skills, as well as the ability to visualize issues and communicate them to others.
• Outstanding organization, coordination and leadership skills – ability to coordinate and motivate TMs from multiple sites and different background.
• Ability to work collaboratively and pro-actively in a team environment.
• Moderate skill in excel and simple code writing desired.
• Effective delegation skills.
• Experience in managing large-scale construction projects.
• Language: Chinese, English. Japanese would be preferred.

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area

- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap

- Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements

- Work with equipment suppliers to develop new capability

- Engage in active participation in Package Development Engineering activities

- Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need

- Create decision matrix for equipment and material selection

Installation and qualification of new equipment platform and handover to production group (pilot line setup)

- Plan/submit capital request to acquire new Equipment

- Create purchasing specification (Doc2) document

- Establish the new equipment qualification criteria and activities roadmap with respective functional - team

- Establish project handover requirements and procedures upon machine qualification

- Prepare documentation for handing over with respective site owner

- Conduct data gathering for low volume production

- Conduct training for Site representatives

- Feedback loop for Continuous Improvement after mass volume production

Maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

- Maintain and regularly update the TOR, with inputs from local or other assembly site

- Maintain general knowledge of process and material characteristics and translate to equipment design requirement

- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

- Maintain knowledge of design constraints and weakness of existing platform

- Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Minimum 2 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good teammate, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Strong project management skills to ensure execution to timelines

Job Description

As Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations
• Background in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals will be beneficial

Keen on the role? Apply now!

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope in Metro Real-time Defect Analysis (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will manage and optimize your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor's/ Master's/ PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front End areas, in Post Wafer Fabrication & High Bandwidth Manufacturing technology is of greater advantage.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Hands on in recipe development for inspection and measurement workstation such as KLA, Rudolph, Nordson, CAMTEK preferred

Keen on the role? Apply now!

In a Product Yield Enhancement (PYE) as a Physical Failure Analysis (PFA) Engineer, you will be responsible for providing full PFA, circuit edits and functional de-capsulation, supporting qualifications, customer returns, new device introduction, and general test failures.

Key Responsibilities :

• You will become a subject matter expert on PFA, circuit edits and de-capsulation methods, tools and techniques.
• You will also be responsible for understanding all relevant analytical techniques; electrical failure modes, architecture, fabrication process, device operation and device physics for solid state memory devices.
• You may need to collaborate with stakeholders to present on failure analysis findings.
• In this work environment you will be required to follow lab policies and safety procedures.

Requirements :

• Degree graduates in Electrical and Electronics Engineering / Microelectronics / Mechatronics or equivalent.
• At least 1 year or more experience in Physical Failure Analysis, Fab, Assembly work environment or related experience.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems.
• Willing to work on 12 hours rotating day/night or permanent night shift.

As Sr/Engineer for PDE Technology Development Process Integration, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip/package interaction, equipment capability and process technology in the industry and the ability to enable best technology for New Technode & Product Introduction with assembly packaging requirements. You will also be required to drive & collaborate with multi-functional teams to resolve assembly process related problems.

Key Responsibilities

Ensure smooth transition from new process development, 1st qualification success to small volume production launch

• Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule
• Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
• Lead/partner with cross function team/site, to ensure successful transfer to CEM for LVM.
• Qualify new process/technology/equipment/materials
  Implement PDE TD PMI (Product Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM

Identify path finding opportunities for continuous yield improvement and cost reduction activities

• To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
• Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

Provide new solutions on time to meet company and customer needs

• Define, develop and establish process capabilities, strategy and roadmap
  To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements:

• PhD/Masters/Bachelor’s in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• At least 2 years' experience in semiconductor industry
• Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology
• Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus
• Strong project management skills to ensure execution to timelines
• Strong communication and presentation skills
• Understanding of business needs and customers’ requirement
• Ability to integrate & partner with people from cross function teams

Keen on the role? Apply now!

As a Product Engineer at Micron, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers. Product Engineers are the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments.

Key Responsibilities:

• Responsible for both product development and supporting high volume manufacturing of SSD (BGA SSD)
• Develop high quality and cost efficient BGA SSD test strategies
• Support for SSD failure analysis from NPI to HVM stage
• Perform manufacturing yield evaluation and data analysis
• Perform electrical and physical failure analysis and work with other departments to resolve SSD related issues
• Troubleshooting failure from customer return and provide solutions to fix the problems

Requirements:

• Degree in Electrical/Electronic/Mechanical Engineering with at least 1 year of experience in Product Development/Product Engineering
• Proficiency in programming languages such as C, C++, Python, Perl and etc.
• Relevant working experience on Controller PCIe Protocol, failure analysis, big data analysis and TTR project.
• Relevant experience in SSD industry and knowledge in NAND component testing and failure analysis will be an advantage
• Relevant experience with computer hardware, knowledge of storage interface such as NVME will be an advantage
• Excellent problem solving and analytical skills
• Effective communication and presentation skills

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Key Responsibilities:

• As a Firmware Development Engineer at Micron, you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems.
• You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors.
• You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues.
• You will triage failures, file bug reports, and help the development teams with isolating issues.

Requirements:

• Degree in Computer Engineering/Electrical and Electronics Engineering with at least 1 to 2 years of experience as Software or Firmware Developer.
• Proficient in C Programming: Strong coding skills in C are required for firmware development.
• Experience with Embedded Software Development: Design, develop, and optimize embedded software for memory controllers.
• Skilled in using scripting languages (e.g. Python), programming tools and environments, will be beneficial.
• Experienced with NAND flash and other non-volatile storage is a distinct advantage.
• Storage Industry Knowledge: Understand the storage industry, especially SSDs, HDDs, and related technologies, will be beneficial.
• Storage Interface: Understanding of storage interfaces, such as PCIe/NVMe, is desirable.
• Flexible and adaptable to work in a multi-functional team and handle multiple priorities.
• Problem-Solving Abilities: Ability to troubleshoot and debug embedded systems.
• Collaboration and Teamwork: Work effectively in cross-functional teams to address product development challenges.
• Independent and self-motivated.