Total 288 purchasing engineer job vacancies in Singapore

Micron’s NTI TD group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Description

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Diffusion team on the key technology issues that need Technology Development (TD) breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
• Ownership of module business process

Requirements

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are welcomed to apply.
• A deep understanding of flow dynamics , thermodynamics, physical phenomena and their direct application to Diffusion deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2 - 4 months at a stretch to work on technology development.

You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Responsibilities

• Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts.
• Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Masters degree or higher in Materials Science, Chemical Engineering or Physics.
• Familiarity with regE process developments and yield improvements.
• Understanding of various integration and structural impacts and constraints related to wafer edge.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally.
• Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
  
  Requirements
• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcomed to apply.
• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development.

Responsibilities

• Process module ownership involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer CMP processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.
• Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Masters Degree or higher in Materials Science, Chemical Engineering or Physics
• Hands-on experience in leading edge CMP polishing equipment preferred.
• Familiarity with CMP equipment operation, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• In-depth understanding of polishing mechanisms for dielectric and metal CMP.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

You are responsible for, but are not limited to, the following:

• Develop and optimize lithography processes to meet yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing photolithography team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Collaborate with Boise R&D peers on technology adaptation and cost optimization towards upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Description

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

• Disposition of Fab lots affected by planned or unplanned deviations (including those from Special Work Requests and Fab Conversions, or from Quality Deviations and Excursions).
• Work closely with Fab partners to identify and contain excursion material. Initiate and lead multi-functional MRB (Material Review Board) to conduct risk assessment and decide upon disposition of excursion material.
• Review and analyze proposed process conversion changes to ensure that the proposed manufacturing changes conform to current business standards, improve Micron’s competitiveness in terms of wafer yields and costs, and protect Micron’s product quality.
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products.
• Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations.
• Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary.
• Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed.
• May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations.
• Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

Requirements

• Bachelor's Degree in Electrical or Chemical Engineering, Material Science, Physics and 3+ years of semiconductor industry experience
• Knowledge of Electrical and Physical Failure analysis of semiconductors
• Knowledge of semiconductor memory product and reliability testing
• Strong understanding of NAND FLASH operation and structure
• Intermediate understanding of wafer fab manufacturing process steps, functional probe and parametric testing methodologies
• Excellent statistical data analysis, troubleshooting and decision making skills
• Proven track record to work effectively in both an independent role and in team environments
• Excellent multi-tasking and problem solving skills
• Intermediate PC skills including MS Office Word, Excel and PowerPoint
• Ability to clearly communicate data and findings both verbally and in writing.

You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Relevant experience in Dry Etch Process Development is a plus
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Job Description

As a Senior or Principal NAND Device Engineer in the Device Technology Development group at Singapore site of Micron Technology Inc., you will be responsible for analyzing the cell device characteristics, engineering memory device/array operation, and developing novel solutions for next generation NAND technologies in order to meet the required cell and array performance within project timelines. You will have an exciting opportunity to be front and center in the development of the most cutting-edge NAND technologies and products in the world!

Your responsibilities will include, but are not limited to:

• Contribute to the device technology development of state of the art NAND cell, in particular by providing expertise in NAND Cell device physics and NAND memory array operation.
• Perform electrical characterization of NAND cell arrays and test structures to identify device improvement directions.
• Contributing to the cell improvement effort (performance, reliability) by providing feedback to the Process Integration and Cell teams in Singapore and in Boise on process experiments and possible interactions with array operation.
• Trim and waveform/algo engineering in order to improve Vt placement, performance and reliability. Utilize first principles device knowledge to develop novel array solutions.
• Strong collaboration is required with product engineers and probe engineers.

Requirements:

Successful candidates for this position will have:

• Ph.D or Master’s degree in Electrical engineering with focus on Semiconductor devices
• A strong understanding and experience with nonvolatile memories and in particular, NAND device physics.
• A strong understanding of semiconductor devices and processes.
• Experience with NAND cell trim and algo development is preferred.
• A strong understanding of statistics.
• Solid communication and reporting abilities.
• The ability to be highly skilled at driving for results.

Your responsibilities will include, but are not limited to, the following:

• Discover yield issues in NAND development and identify unique metric or combination of metrics, such as wafer/dice/tile shading, ECATS or other custom metric for issues quantification.
• Interact with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to drive clear definition of yield, cell, CMOS, qual, and reliability issues and pareto and derive improvement actions needed across tech-nodes and designs.
• Own and drive non-standard deep dive statistical analysis of inline, probe, cell, and other critical metrics to define issues/problems, enable early inline detection, and improve the product yield and quality. Quantify and track progress on the issue hit hate, line impact, gap to program goal. Quantify yield improvement/downside seen based on process/probe changes.
• Initiate data mining and correlation study on new issue seen. Initiate PFA request to identify root cause of yield issue. Perform inline correlation study to establish inline prediction to yield issue. Make yield projections based on expected improvement/downside. Conduct yield trend analysis, identify root causes in process step, conversion, algorithm change, and design, for yield shift.
• Continuously develop/re-define inline detection in collaboration with metrology and RDA team.
• Identify and define gaps with current test and co-develop (with product, probe, param engineering) unique parametric/probe bins to detect new fail modes as well as validate new program release.
• Collaborate with module owners to identify, quantify key module deficiencies/technology gaps, and drive cross-functional teams to address. Optimize existing layout, conceptualize, and develop innovative solutions to meet product requirements and manufacturability.
• Develop and innovate techniques in extracting data from different databases through various query languages and automate through scripting to improve work efficiency.
• Assist and support the transfer documentation of layout/architecture fundamentals of new technology from R&D to manufacturing fab.

Successful candidates for this position will have:

• Minimum of 3-5 years of experience in the semiconductor industry in the areas of Process Integration, Yield Enhancement, Failure Analysis, Data Science, or Unit Process.
• Ability to develop a strong holistic end to end understanding of PI module on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with nonvolatile memories along with good understanding of the process flow, interaction of process & device, common yield & reliability issues are desirable.
• Curiosity and natural tendency of learning new things independently.
• Exposure to R&D and transfer/manufacturing is desirable.
• Deep understanding of layout and architecture of NAND product.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection is desirable.
• Fluency in Python, JavaScript, C or C++ is desirable.
• Ability to be self-motivated and self-governing with proven ability to work in a demanding and dynamic environment.
• Ability to drive and coordinate cross-functional teams to achieve various goals.
• Solid analysis, communication and reporting abilities with demonstrated presentation abilities.
• Ability to travel for extended periods of time to the US or other fabs for collaborative R&D work.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Data Science, Computer Science or related field.

Job Responsibilities

• Advanced process development tasks such as developing SEM, OCD, or other metrology related equipment, driving the understanding of new metrology technology and measurement techniques in 3D NAND technology.
• Own applications and develop processes of new nodes, including supporting Fab4 in the development of recipes/models of wafers running in Fab4.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Bachelor’s/ Masters in Electrical, Material Science Engineering would be advantageous.
• Relevant experience (>2 year) in Metrology Process Development is a plus
• Fresh Graduate are welcomed to apply
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

NTI NAND Senior/Principal Process Integration Engineer

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work

Prefered to have Skills / Experiences as below:

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.

As a Product Engineer at Micron, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers. VPE is the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments.

You will have the opportunity to work on leading-edge and latest Non-Volatile Memory in the industry. In this role, you will have the chance to work and interact with cross-functional teams, learn more about NAND Flash, High Speed Capacity (HSC) & Solid State Drives (SSD), and will have exposure and holistic view of various aspects of product development, qualifications, ramping and testing at both frontend and backend.

Key Responsibilities :

• Work on NAND & HSC product development, focusing test coverage development and yield improvement.
• Carry out circuit simulation, wiki/macro development, engineering yield evaluation and data analysis, test calibration and validation for best-in-class quality / coverage and test time optimization.
• Perform in-depth electrical failure analysis to understand the root cause of the yield issues or NAND/HSC related failures.
• Work with system team to resolve NAND/HSC related issues during qualification and High-Volume Manufacturing (HVM) phase.
• Improve robustness of test coverage and screen development, leveraging on the vertical integrated model to maximize yield and quality.
• Utilize various engineering systems / platforms and state-of-art equipment to support product characterization and electrical failure analysis.

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering with at least 3 years of relevant experience in Semiconductor industry.
• Experience and knowledge of failure analysis methodologies.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems.
• Knowledge of Complementary Metal Oxide Semiconductor (CMOS) device physics, & SSD is an added advantage.
• Knowledge of CMOS circuit design, CAD/Simulation and test flow and system architecture is an added advantage.
• Knowledge and experienced in component and system level testing, analysis and debugging is an added advantage.

As a Senior / Product Validation Engineer at Micron, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers.

Key Responsibilities :

• Perform firmware validation on SSD devices which include both new and sustaining devices with new Firmware revisions
• Define and create new validation test plan for new SSD products
• Conduct failure analysis of failures generated from validation run and collaborate with various SSD Development groups to resolve issues detected
• Maintain and enhance Validation coverage through regular reviews and feed forward paths to ensure optimum customer integration experience and customer qualification success of SSD products
• Communicate project status and report on a regular basis
• Work closely with Manufacturing, Operational and Development Groups to ensure a smooth collaboration and alignment among teams and deliver company roadmap SSD projects on schedule
• Provide support in the analysis and resolution of internal/external customer issues
• Develop test automation solutions to improve testability and execution efficiency

Requirements :

• Degree in Electrical and Electronics Engineering / Computer Engineering with at least 2 years of relevant experience
• Programming knowledge in Python and/or C++
• Knowledge of storage device drivers and SATA and/or PCIE chipset register configurations would be beneficial
• Relevant work experience in either SSD or HDD industry is an added adavantage
• Experience with SATA and/or NVMe storage interface protocols and Windows/Linux Operating Systems is an added advantage
• Ability to work independently with a minimum of day-to-day supervision
• Ability to work in a multi-functional team and under the pressure of multiple priorities

Responsibilities and Tasks:

• Use knowledge of data analytics, machine learning and UI development tools and programming language to develop application to support the work needed
• Communicate effectively on approach and methodology in developing analytics or reporting solution.
• Demonstrate sound project management skills in requirement gathering, resource estimation, time management, stakeholders engagement and deliverables deliveries.
• Demonstrate sufficient understanding of line management, capacity modelling, Cycle Time modelling as well as various area specific manufacturing processes.
• Collaborate effectively with team members and stakeholders both internally and externally.
• Participate in multi-area focus teams to improve complex constraint in line management or Cycle Time problems.
• Possess excellent verbal and written communication skills and the ability to present project/approach/data in meetings with varying level of stakeholders.

Requirements:

• Drive to make a difference and passion to explore new frontiers!
• Proactive and collaborate effectively in a rapidly changing environment.
• Highly motivated, with a strong work ethic, and can work independently.
• Master’s / Bachelor’s Degree in Engineering, Business Analytics, Data Science and Analytics, Industrial and Systems Engineering or related field of study.
• Proficiency in basic programming skills, preferably Python and SQL.
• Knowledge and experience in data analytics, business intelligence and machine learning is a plus.

Responsibilities:

• Maintain and validate capacity/space models to enable accurate assessment of production loading needs
• Apply Industrial Engineering concepts to line management, capacity analysis, scheduling and production planning
• Develop models for non-equipment related capability to meet the Fab output requirements.
• Managing complex projects across several different departments and sites, working pro-actively with other departments to identify areas of improvement and actions.
• Coordinating efforts of the site industrial engineering teams to continuously improve production metrics and optimize use of installed capital
• Understand the impact to the metrics driven by output changes through scenario analysis Provide inputs and support network optimization and long-term strategy discussions.

Requirements:

• Bachelor’s degree in engineering or related discipline
• Good in written communication and presentation skills
• Highly motivated to work in a dynamic environment, with good integrity and character
• Ability to multi-task and organize work systematically in meeting dead-lines without compromising on quality
• Proficient in programming skill will be an added advantage

Responsibilities:

• Maintain accurate capacity modelling of assigned Fab area
• Apply industrial engineering concepts to capacity analysis, line management, scheduling and production planning
• Use statistical analysis to maintain and audit manufacturing capacity information
• Design and coordinate projects with several different departments
• Work with management to develop applications to continuously improve production metrics
• Collaborate with research & development and process engineering to plan for future product introduction
• Evaluate scenarios representing changes in modeling, perform what if scenarios as needed, and work with Engineering and Production to understand the impact of the changes
• Coordinate capital purchases and capacity changes with corporate planning and purchasing
• Partner with the Area Managers to keep updated on area issues, priorities and projects

Requirements:

• Bachelor's Degree in Industrial Engineering, or related discipline and/or equivalent experience
• Strong understanding of statistics and data analysis
• Possess understanding of Manufacturing Science (scheduling, inventory management, capacity modeling, etc)
• Excellent written and verbal communication skills
• Possess good teamwork skills and strong multi-tasking capability
• Ability to be self-motivated and work effectively with minimal supervision
• Able to collaborate freely and communicate openly and clearly with co-workers
• Ability to solve problems and address root causes
• Basic understanding in programming is preferred

As a DDQA (Development and Design Quality Assurance) Backend of Line Reliability Senior Engineer, you will be primarily responsible for developing and optimizing quality and reliability criteria related to Metal Interconnects and Wafer-to-Wafer Bonding (W2W) process for the next generation of Micron's memory parts in the Global Quality Team. You will also be required to identify, diagnose, and resolve BEOL metal interconnects and W2W bonding assembly process related problems by applying failure analysis, FMEA or 8D methodology. In this position, you will be working in a highly collaborative atmosphere, interacting with various groups such as Technology Development (TD), Process Integration, electrical and physical failure analysis, Product Engineering, Quality Reliability Assurance Team to develop product that meets Quality and Reliability specs and requirements.

Responsibilities include, but not limited to:

• Define & implement Reliability test methodology for new Metal Interconnects and Hybrid Memory process (PWF=Post Wafer Finish/W2W bonding) for the next generation of Micron's memory parts.
• Drive dielectric and W2W Bonding technology roadmaps from Product Quality and Reliability perspective.
• Ensure the device is compliant with Package Level and Wafer Level process Reliability Qualification requirements.
• Collaborate with TD to define the BEOL reliability strategy based on the Process Roadmap.
• Provides periodic updates based on project criticality to stakeholders (including Global Quality (GQ) Leadership and Fab Management) on project status, progress, and roadblocks/opportunities.
• Support technology transfer to production facilities (some international travel may be required).
• Partner with multiple stakeholders in Process Conversion Review Board Meeting (PCRB) to improve coverage from various aspects of product quality and reliability and prevent post qual escapes or excursion triggered by conversion.
• Identify gaps and drive initiatives/programs/business process to build margin around structural, electrical, and reliability performance.
• Partner with TD on latest products and technologies and define quality and reliability fail modes especially NUDD (New, Unique, Different, Difficult) with goal to mitigate risk and achieve high quality materials.
• Build Product Fail Modes Repository based on NUDD (proactive) and previous issues (reactive), and work with key stakeholder to prevent issues or implement effective detections controls and containment.
• Deliver a new Product Fail Modes Repository and their Effective Detection Controls and Containment Document to meet technology development and Transfer timeline.
• Partner with Manufacturing (MFG) or Central Quality teams on current high-volume products to sustain and further develop the Product Fail Modes Repository through regular refresh meeting.

Minimum Qualifications:

• 3+ years’ experience in semiconductor related engineering.
• A Process Engineering or Integration or Assembly & Test background and experience.
• Hands-on experience on Backend of Line Metal Interconnects process (Cu, Al, TSV, Dielectrics) from any Process Module or Process Integration, or Metal Reliability testing (electromigration, High Temperature Storage etc) is strongly desired.
• Knowledge or exposure in Wafer-to-Wafer Bonding technology and failure mode is a strong plus.
• Must possess engineering knowledge of semiconductor processes. Knowledge of NAND Fab processes, flow and fail modes is preferred.
• Highly skilled at problem-solving activity and capability of leading cross functional team.
• Understanding on technical risk assessment, FMEA, and 8D methodology for root cause analysis and problem solving.
• Effective verbal and written communication skills in English.
• Good multitasking skills and ability to set priorities in a fast moving, dynamic environment.
• Ability to work independently, with minimal direction, and a focus on meeting commitments.
• Real passion for improving product quality to increase customer satisfaction.

Responsibilities and Tasks:

• Promote and enable a safe and positive working environment
• All team members are required to complete their learning items within the stipulated time frame
• Response to unscheduled events that affect production line, develop recovery plans, allocation resources and provide timely status and impact updates to coordinate with the stakeholders as the initial Site Management Coordinator (SMC) till handover to crisis management task force
• Lead and set directions for the Shift team to attain alignment, drive mitigation plans for the constraints and gaps, and effectively manage the Shift resources to meet wafer outs, cycle time and output plan
• Conduct Shift passdown to review shift performance and assign priority issue to the supporting functions, and set production targets and directions for daily activities
• Work closely with hold lot owners to dispose and move production materials in timely manner to meet output requirements
• Manage Remote Operation Centre (ROC) and drive continual improvement in Business Process, MFG systems and reporting
• Approve and manage SIPP work to minimize impact of SIPP works to production through planning and execution to plan
• Collaborate with relevant cross functional teams in building Automation Systems, infrastructure, Dashboards, etc. for the shift team to be more efficient and effective i.e manufacturing system deployment and enhancement
• Create, prioritize, and manage multiple productivity and quality improvement projects, such as cycle time reduction, scheduling effectiveness, operations simplification, man model optimization, etc. that lead to increasing die shipped
• Partner with Probe Software/OI team on area scheduling, automation, and line management systems and successfully roll out to the shift team
• Conduct performance management and professional development of TMs through partnering with Work Force Development and Area team to develop and implement tactical and strategic training plans
• Develop and mentor MFG Leads successor for key appointments in the Probe MFG team.

Requirements :

• Bachelors Degree in Engineering
• Basic understanding of manufacturing concepts (capacity planning, cycle time, operations research, factory physics, production planning/scheduling, etc)
• Basic understanding of process/equipment knowledge
• Strong analytical and problem solving skills with the ability to identify and close inefficiency gaps
• Proficient in Microsoft office skills
• Independent and self-motivated
• Ability to multi-task, work efficiently, and complete the assigned tasks within designated timeline
• Adaptive to change and challenge in high pace manufacturing environment
• Strong leadership and communication skills

As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities

• Install First-of-Kind equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
• Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
• Work with process development team to quantify benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
• Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
• Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
• Design and implement advanced equipment monitoring and control methodologies.
• Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
• Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
• Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.

Requirements

• A minimum of 2-3 years of experience in the semiconductor industry in the area of equipment engineer roles.
• In-depth understanding of the equipment operation, working principles, trouble-shooting and tool installation procedure is desirable.
• Exposure to semiconductor R&D equipment transfer or development is preferred.
• Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Experience leading team or sites or suppliers on complex projects.

As the Global Facilities Tool Installation role in Micron Technology, Inc., you will be responsible to drive improvement of AT Manufacturing in partnership with Site Facilities, Global Procurement & TD network, aligning to and executing global business strategy as well as delivering continuous improvements to meet industry benchmark for TI.

Your key objectives are managing TI program and mentoring program/project managers to achieve business goals and objectives while ensuring adequate internal/external resources to create alignment in TI BKM procedures and define material specification requirements based on technical assessment and lesson learns, to ensure business procedure are aligned across Micron manufacturing sites for DRAM and NAND. In addition to these, further optimization of BKMs to ensure Micron’s leadership in global TI will be actively pursued. Due to its global nature, occasional international travel is required.

This role requires flexibility and ability to maintain global relationship, good communication and presentation skills, provide clear and qualitative data analysis for the higher management to support decision-making. You should be a detailed oriented person, which the capability of managing changes. You should also possess detailed understanding on structure, finding opportunities for optimization and providing benchmarking.

Responsibilities:

• Drive and support site TI project
• Track global TI project schedule status.
• Drive BKM alignment
• Drive TSR and TUM Data System Alignment
• Tool Installation Design Package Standardization.
• Facilities Capacity Planning System Standardization.
• TI Material spec Alignment
• Standardize and consolidate documentation for all modules Tool type.
• Managing Bid Sheet alignment and Tracking
• Build close and effective relationship with Sites, Facilities and Supplier teams.
• Understand and adopt best safety practices across sites.
• Influence global peer groups to ensure alignment on strategy and roadmap to achieve area objectives with clear line of sight to strategic objectives and protecting business plans.

Leadership and Team Building

• Ensures the goal setting and development plans are created for each team member.
• Encourages, mentors and empowers team members to propose their ideas and supports implementation.
• Effectively delegates and prioritizes issues for team.
• Proactively works towards creating a positive working environment through timely conflict management and resolution.
• Maintains relationships with other areas and organizations to enable teamwork across group boundaries.

Strategic/Tactical Leadership

• Track metrics for benchmarking respective Fabs Performance. Identify and share BKMs across sites and track compliance to agree upon alignment to Best Known Method (BKM).
• Provide tactical support and coordination for the Fabs as required for issues of Safety, Output and Cost.
• Willing and capable of international travel, as needed, to accomplish the goals.
• Work together with fab as a team to solve problem.
• Lead to fan out and align the best known BKM across the fabs in the network.
• Strong people and collaboration skills to lead globally sites on BKM and Business process alignments.
• Self-motivated: Able to work independently with minimal supervision.
• Dependability and able to work effectively in cross-functional teams.
• Good organization skills and able to plan and prioritize.
• Excellent verbal, listening and written communications skills.
• Strong attention to details
• The ability to interface with suppliers professionally.
• Willingness to work during non-standard hours when needed to provide support technical teams at other Micron sites.
• Able to travel when required to support department and company objectives.
• Excellent problem solving and analytical skills.
• Proficiency with MS Word, MS Excel, MS PowerPoint, and MS Outlook.
• Understanding of PAC and tool process releases is a plus.

Requirements:

• Bachelor’s degree in engineering.
• Minimum 5 years relevant semiconductor industry experience in a 300mm FAB.
• Good leadership skill in mentoring and managing the performance of teams.
• Excellent communication, analytical skills and good decision making.
• Proven ability to make decisions, multi-task, and troubleshoot problems and address root causes.
• Have demonstrated leadership skills including team and individual development.
• Good teamwork and collaboration with other groups, internally and externally.
• Measure self for efficiency and effectiveness
• Willing to travel.
• Proven ability to drive complex projects to completion.
• Strong project management skills a plus

Plans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of facilities and equipment, and compliance with laws and regulations. Coordinates with architecture/engineering firms in developing design criteria and preparing layout and detail drawings. Prepares bid sheets and contracts for construction and facilities acquisition. Reviews and estimates design costs including equipment, installation, labor, materials, preparation and other related costs. Inspects construction and installation progress for conformance to established drawings, specifications, and schedules. Develops criteria and performance specifications required to meet unique operating requirements and building and safety codes.

As a Product Engineer at Micron Technology, Inc., you will be responsible in developing, validating, characterizing, and qualifying new state-of-the-art NAND Flash memory products. In this role, you will be involved in pre-silicon conceptual design and preparation work, run simulations, create and maintain design and validation documentation, analyze bench and parametric data as well as to debug & resolve yield, quality and reliability failures due to design related issues. You will also refine and develop best known methods and automation for design validation of current and future products.

You will also be responsible to work with NAND R&D, Designers and other various Engineering functional groups to troubleshoot, develop and validate new designs to meet specific product requirements. Product Engineers are the key product-specific point of contact for critical issues and act as the main interface between Research and Development, Manufacturing, Business Units, and Quality Assurance departments.

Responsibilities:

• Responsible for new product startup to deliver product specifications and requirements
• Define and validate product configuration parameters
• Create validation flow for silicon design margin characterization and validation in volume.
• Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations
• Identify design marginalities and recommend design fix for circuit-related problems
• Perform electrical failure analysis to understand the root cause of device marginalities or failures
• Utilize engineering bench and testers to perform device characterization and electrical failure analysis

Qualifications/requirements:

• At least bachelor degree from Electrical/Electronic Engineering
• Possess problem solving and analytical skills
• Good multitasking and organizational skills
• Strong presentation and communication skills, self-motivation and enthusiasm

Equipment

• Responsible for TEST TOR (Tool of Records) equipment sites' support, evaluation, trouble-shooting and installation
• Fan out Best-Known Method to all sites in TOR procedures, deficiencies, and designs/implements improvements.
• Work closely with process engineering and site’s equipment maintenance team to develop and support new process/technology implementation.
• Monitor and identify process efficiency, OEE and makes recommendations for improvements.
• Supports TOR Equipment OS (Operating Software) and software release.
• Supports evaluation on new technologies and equipment to improve current tool sets and method.
• Independent and self-driven in projects/tasks assigned.
• Occasionally need to travel to support relevant projects/deployment.

Support internal/external Customer

• Responsible in conducting and mentoring sites equipment owners to undertake new project in SWAT Team (Strategic Work Alignment Team）. Eventually enabling the CST member to take up active roles and responsibilities.
• Support High Volume Manufacturing site request as needed.
• Reprioritize the customer requests as needed.
• Respond to the external customer requirement as needed.
• Diagnose test area equipment problems and implement solutions.

Qualifications

• Bachelors' or Masters' in Electrical and Electronics Engineering or Mechanical Engineering
• Design or automation core skill
• Knowledge of Backend manufacturing TEST equipment and processes.
• Good understanding of equipment electrical/mechanical fundamental such as: electronics circuit, infra-structure, mechanical function and the reliability of the equipment.
• Excellent in problem analytical and decision-making ability is required.
• Proficiency with data analysis tools: Decision Analysis, RA (Risk Assessment), FMEA (Failure Mode Effective Analysis) and change management process.
• Experiences in backend equipment maintenance/engineering area would be preferred.