Total 300 quality control engineer job vacancies in Singapore

Product Integration Engineering team strives to deliver pioneering process capability, best-in-class bits per wafer (Yield) with highest quality and fastest speed through innovation and collaboration with multi-functional team. With the diversity of technology in DRAM/NAND and geography (TD development sites – Boise/Japan, 5 manufacturing sites – US (F6), Taiwan (F11/F16), Japan (F15) and Singapore (F10)), Frontend Central PIE team will be responsible to identify best-known-method holistically, align best-known-method timely and implement improvement systematically across the network. As FE Central PIE Standardization & Metrics Senior Engineer you will be responsible to lead the the team on:

• Drive for alignment and standardization across various fabs on Best-Know-Methods (BKMs)
• Develop Metrics to measure the standardization, sustainability, scalability and synchronization of the BKMs.
• Identify gaps in current programs and use SMART metrics to drive effectiveness and efficiency on program deliverables.
• Transform yield SEAL and SWATs to achieve cPIE missions, improving network resource/talent leverage.
• Constantly drive productivity and eliminate inefficiency / ineffectiveness through metrics and reports automation, drive data to be accurate, accessible and comprehensive.
• Collaborate with various multi-functional teams on yield reports, develop business process to optimize current system with clear roles and responsibility.
• Promotes cPIE teams alignment and collaboration with crtical metrics /metrics definition.
• Collaborate with WFD to standardize network PIE training curriculum, connect with cPIE and network PIE to build training courses.
• Develop human resource strategies to attract, retain and reward talent and effectively deploy them to enhance every individual’s potential
• Engage team members and drive accountability, performance driven culture through clear communication, formal and informal feedback, goals and critical metric
• Drive diversity, equality, and inclusive working environment and foster teamwork and trust in the organization
• Effectively manage team’s internal and worldwide meeting structure. Ensure meetings are efficient, effective and targeted to achieve required outcomes.
• Maintain knowledge of equipment and materials safety concerns. Take a proactive approach to safety, and apply corporate and site safety resources for partner concern issues as appropriate.
• Maintain a strong and open relationship with peer group and managers in other functional areas within CPIE and outside organizations such as Fab, FE PMO/SIC/OCT and Global Quality.
• Travel to Micron sites as necessary for face to face collaboration.

Requirements:

• Bachelor’s Degree in Engineering and related field of study
• 2 years experience in engineering field
• Applicants must have a proven ability to collaborate globally and influence by indirect leadership to drive resourcing to critical projects across Micron
• Applicants must have a proven capability in dealing with complexity and an ability to use resources effectively to bring clarity to required actions
• Applicants must hold a record of performance excellence for current area of responsibility; and are recognized as having demonstrated successful leadership characteristics both in present and past jobs
• Applicants must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work

Preferred to have Skills / Experiences as below:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics, Semiconductor Device Physics.
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement preferred.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Responsibilities and Tasks:

• Establish and improve process condition and technology.
• Upgrade process capability and reduce production cost.
• Establish and modify process management projects.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluation, promotion and planning of new equipment / materials.
• Abnormal analysis and improvement.

Requirements:

• Minimum Bachelor's degree in Electrical & Electronics, Chemical, Mechanical, Materials Engineering or equivalent.
• Problem-solving mindset with a drive for finding effective solutions.
  • Passion and interest in semiconductor frontend fabrication and memory industry.
• Strong communication skills (written, verbal and presentation).
• Strong personal initiative and ability to work in a fast-paced and dynamic environment.
• Knowledge of Statistical Process Control (SPC), Design of Experiment, Engineering Statistical data analysis would be advantageous.

• Collaborate with sister fab’s PIE, Process Equipment Engineer, QEM teams to improve yield and reliability.
• Communicate module related issues to the Fab engineering and leadership teams.
• Design, implement, and analyze experiments to improve fab process, yield, and quality.
• Collect and interpret complex data to optimize Fab processes and increase yields.
• Engage and/or lead cross-area engineering teams to solve process issues.
• Work closely with global partners to know the latest on module related topics and process alignment projects.
• Collaborate with other PI module owners and sister fabs to drive business process alignment
• Partner with Industrial Engineer (IE), Process Equipment Engineer (PE, and Production to better forecast and balance yield, output and process issues.

Requirements

• Bachelor's degree, Master's or PhD in electrical, electronic, material, physics field or related team and/or equivalent experience
• Structural and process integration knowledge with basic comprehension of process area preferred
• Knowledge of fabrication processes, probe, backend and reliability implications preferred
• Understanding of statistical process controls
• Understanding of basic device physics in deciphering product performance
• Strong verbal and written communication skills
• Good data compilation, statistical analysis and reporting skills

Responsibilities:

• Hands-On Data Analytics: Develop foundational data analytics skills to contribute to defectivity improvement projects.
• Data Mining Exploration: Gain exposure to advanced analytics techniques to identify and address deviations in machinery and processes.
• Experimentation & Learning: Engage in designing experiments to identify defect sources and formation mechanisms, gaining valuable insights in semiconductor processes.
• Collaborative Innovation: Work closely with engineers from diverse departments to contribute ideas and assist in implementing breakthrough solutions for defectivity improvement.
• Brand new Inspection Tools: Use the latest pioneering inspection tools for defect detection, contributing to advancements in semiconductor manufacturing.
• Statistical Process Control Exposure: Learn to set appropriate control chart limits and use effective sampling for proactive intervention against machinery and process deviations.
• Smart Sampling Techniques: Implement smart sampling methodologies to proactively detect and address deviations, ensuring efficient and effective root cause identification.
• Defense Line Strengthening Projects: Contribute to strategic projects aimed at minimizing products at risk and enhancing overall product quality.
• Case Review & Solutions: Participate in case reviews upon process deviations, assisting in identifying business process gaps and proposing solutions.
• Innovation & Learning: Collaborate with the Data Science and Smart Manufacturing AI teams, contributing to the deployment of smart solutions and staying at the forefront of technological advancements.
• Global Collaboration Exposure: Engage with global partners in the Micron Network, fostering collaboration and knowledge sharing.

Requirements:

• Bachelor's Degree in Engineering: Hold a degree in any engineering field to apply theoretical knowledge to real-world scenarios.
• Fresh Graduates or 1-5 Years of Experience: Open to energetic fresh graduates or candidates with 1-5 years of proven experience in the field.
• Passion for Engineering: Showcase your enthusiasm for semiconductor manufacturing.

Team Collaboration: Demonstrate your ability to work well in a team, eager to learn and contribute to a dynamic work environment.

Responsibilities:

• Lead the automation and autonomous development of warehouse processes, and exploring new frontiers in warehouse technology.
• Develop and implement strategies to optimize human-machine collaborations, ensuring lean and effective spares/material storage and distribution from Warehouse to Fab.
• Ensure the timely and accurate receipt and distribution of both inventory and non-inventory goods to internal customers.
• Maintain inventory stock through regular cycle counts and inventory auditing.

Requirements:

• Bachelor's or Masters Degree in Engineering, Science, Supply Chain management, Logistics and related field
• Proficiency in warehouse automation systems, robotics, and related software
• Equivalent experience in warehouse processes, logistics, and supply chain management would be helpful

Responsibilities

• Process module ownership involving regE process characterizations and advanced process developments for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop regE processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer regE processes to high volume manufacturing (Fab10), and work on continuous improvements to manufacturability.
• Address specific wafer edge issues (such as bevel defects, uniformity issues), working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving regE process margins required for meeting the mature yield goal for 3D NAND parts.
• Initiate and manage experiments to widen regE process margins as well as to test out manufacturability of next node solutions
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Masters degree or higher in Materials Science, Chemical Engineering or Physics.
• Familiarity with regE process developments and yield improvements.
• Understanding of various integration and structural impacts and constraints related to wafer edge.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

Responsibilities

• Maintain equipment for SSD assembly processes

• Lead & manage shift technicians

• Spare management

• Lead Electrostatic Discharge (ESD) and chemical control for SSD production floor

• Safety representative for SSD Process and Equipment Engineering

• Ensure operation is in compliance with IATF/ISO requirements

• Support internal and external audits

Requirements

- Bachelors in Mechanical/ Mechatronics/ Electrical and Electronics Engineering

- Experience in or knowledge on semiconductor manufacturing process and technologies

- Leadership experience/potential

- Experience in supervising a team of technicians would be beneficial

- Experience in equipment maintenance and troubleshooting

- Experience in mechanical tooling is preferred

- Keen in semiconductor industry

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND products.
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing CVD/PVD teams on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise R&D to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

Requirements

• Master degree or higher in Materials Science, Chemical/Microelectronic Engineering, or Physics.
• A deep understanding of chemical kinetics, thermodynamics, physical phenomena and their direct application to CVD/PVD deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise R&D for 4-6 months at a stretch to work on technology development.

Job Responsibilities

• Advanced process development tasks SEM CD, OCD or other metrology techniques in 3D NAND technology.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Masters/PhD in Engineering would be advantageous
• Experience with semiconductor inspection equipment is preferred.
• Data Science and Data Manipulation skills: Ready to learn and apply basic scripting, coding, or programming.
• Preference for metrology or inspection experience: Especially related to data analysis and root cause investigation.
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

Micron’s NTI TD group is looking for process development engineer to support TD activities associated with rapid deployment of technology nodes, the process margin improvement work necessitated thereof as well as to ensure extended engagement with manufacturing on the upcoming technology nodes.

Description

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Diffusion team on the key technology issues that need Technology Development (TD) breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise TD Films peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
• Ownership of module business process

Requirements

• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Physics are welcomed to apply.
• A deep understanding of flow dynamics , thermodynamics, physical phenomena and their direct application to Diffusion deposition in various deposition methods.
• An ability to understand and troubleshoot precursor depletion effects within three dimensional structures and come up with innovative ideas to mitigate the effects.
• Basic understanding of films and interface engineering and analysis techniques thereof – SIMS, XPS, EDX, SEM/TEM.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2 - 4 months at a stretch to work on technology development.

You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Responsibilities

• Develop and optimize unit processes to meet the yield and quality requirements of advanced NAND part type
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement Prioritize within Singapore based manufacturing Wet Etch team on the key technology issues that need TD breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement Participate with Boise TD peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work with manufacturing and Boise TD to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally.
• Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.
  
  Requirements
• Masters/PhD graduates in Materials Science, Chemical/Microelectronic Engineering or Chemistry are welcomed to apply.
• A deep understanding of chemistry, chemical kinetics, thermodynamics and mass transport
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE) Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 2-4 months at a stretch to work on technology development.

Responsibilities

• Process module ownership involving Chemical Mechanical Planarization (CMP) process characterization and advanced process development for 3D NAND and beyond.
• Work with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3-D NAND nodes.
• Transfer CMP processes to high volume manufacturing (Fab10N), and work on continuous improvements to manufacturability.
• Address process issues working with Fab10N team and with key business partners on tool choices for manufacturing, evaluations etc., as applicable.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts.
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions
• Identify process simplification opportunities and drive cross functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures and equipment.
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction.
• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers.
• This position requires communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
• Be part of the continuous worldwide TD engagement with suppliers pushing for breakthrough solutions.

Requirements

• Masters Degree or higher in Materials Science, Chemical Engineering or Physics
• Hands-on experience in leading edge CMP polishing equipment preferred.
• Familiarity with CMP equipment operation, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• In-depth understanding of polishing mechanisms for dielectric and metal CMP.
• Understanding of various integration and structural impacts and constraints related to film deposition processes.
• An understanding of the general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
• Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data
• Working knowledge of Design of Experiments (DoE)
• Proven ability to collaborate with local and overseas teams on projects
• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Ability to be a self-motivated individual and be adaptable to Micron’s changing needs in terms of working extended hours, if required
• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously
• Ability to travel for extended periods of time and stay at Boise TD for 4-6 months at a stretch to work on technology development.
• Suitable candidates may be considered for Expat posting to Singapore from overseas locations.

You are responsible for, but are not limited to, the following:

• Develop and optimize lithography processes to meet yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing photolithography team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Collaborate with Boise R&D peers on technology adaptation and cost optimization towards upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Description

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS modules. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

• Disposition of Fab lots affected by planned or unplanned deviations (including those from Special Work Requests and Fab Conversions, or from Quality Deviations and Excursions).
• Work closely with Fab partners to identify and contain excursion material. Initiate and lead multi-functional MRB (Material Review Board) to conduct risk assessment and decide upon disposition of excursion material.
• Review and analyze proposed process conversion changes to ensure that the proposed manufacturing changes conform to current business standards, improve Micron’s competitiveness in terms of wafer yields and costs, and protect Micron’s product quality.
• Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products.
• Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations.
• Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when necessary.
• Ensures that established manufacturing inspection, sampling and statistical process control procedures are followed.
• May assure compliance to in-house and/or external specifications and standards, such as GMPs and ISO regulations.
• Evaluates and analyzes the efforts in organizing, documenting, and interpreting inspection support documents and records.

Requirements

• Bachelor's Degree in Electrical or Chemical Engineering, Material Science, Physics and 3+ years of semiconductor industry experience
• Knowledge of Electrical and Physical Failure analysis of semiconductors
• Knowledge of semiconductor memory product and reliability testing
• Strong understanding of NAND FLASH operation and structure
• Intermediate understanding of wafer fab manufacturing process steps, functional probe and parametric testing methodologies
• Excellent statistical data analysis, troubleshooting and decision making skills
• Proven track record to work effectively in both an independent role and in team environments
• Excellent multi-tasking and problem solving skills
• Intermediate PC skills including MS Office Word, Excel and PowerPoint
• Ability to clearly communicate data and findings both verbally and in writing.

You are responsible for, but are not limited to, the following:

• Develop and optimize unit processes to meet the yield and quality requirements of advanced Replacement Gate 3D NAND parts
• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement
• Prioritize within Singapore based manufacturing Dry Etch team on the key technology issues that need R&D breakthroughs.
• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement
• Participate with Boise R&D peers on technology choices for the upcoming nodes and able to translate future technology device needs into clear process requirements
• Identify disruptive processes early on and work to identify viable path forward
• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.
• Identify process simplification opportunities and drive multi-functional teams in implementation
• Incorporate best known manufacturing methods into early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Provide advice and counsel to management on significant technical issues. Lead and initiate ground breaking projects through patents/technical papers.
• Communicate and collaborate with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a requirement.
• Be part of the continuous worldwide R&D engagement with suppliers pushing for breakthrough solutions.

You should possess

• Masters/PhD in Electrical & Electronics, Chemical, Mechanical, Materials Engineering.
• Relevant experience in Dry Etch Process Development is a plus
• Strong aptitude for research and development and ability to create production-worthy technologies.
• Ability to develop and maintain relations with multi-functional teams and vendors.
• Strong communication skills (written, verbal and presentation).
• Highly motivated and adaptable to our demanding, dynamic and rapidly changing work environment; flexibility to work for extended hours, as required.
• Ability to travel to US R&D site for few months to engage in collaborative R&D work.

Job Responsibilities

• Advanced process development tasks such as developing SEM, OCD, or other metrology related equipment, driving the understanding of new metrology technology and measurement techniques in 3D NAND technology.
• Own applications and develop processes of new nodes, including supporting Fab4 in the development of recipes/models of wafers running in Fab4.
• Identify and provide solutions for inline detection in collaboration with process engineer and process integration.
• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe
• Collaborate with US TD Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements.
• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.
• Influence vendor equipment roadmap to enable new technology development in Micron

Requirements:

• Bachelor’s/ Masters in Electrical, Material Science Engineering would be advantageous.
• Relevant experience (>2 year) in Metrology Process Development is a plus
• Fresh Graduate are welcomed to apply
• Capable of international travel up to 3-5 months
• Good communication skills (verbal and written)

Job Description

As a Senior or Principal NAND Device Engineer in the Device Technology Development group at Singapore site of Micron Technology Inc., you will be responsible for analyzing the cell device characteristics, engineering memory device/array operation, and developing novel solutions for next generation NAND technologies in order to meet the required cell and array performance within project timelines. You will have an exciting opportunity to be front and center in the development of the most cutting-edge NAND technologies and products in the world!

Your responsibilities will include, but are not limited to:

• Contribute to the device technology development of state of the art NAND cell, in particular by providing expertise in NAND Cell device physics and NAND memory array operation.
• Perform electrical characterization of NAND cell arrays and test structures to identify device improvement directions.
• Contributing to the cell improvement effort (performance, reliability) by providing feedback to the Process Integration and Cell teams in Singapore and in Boise on process experiments and possible interactions with array operation.
• Trim and waveform/algo engineering in order to improve Vt placement, performance and reliability. Utilize first principles device knowledge to develop novel array solutions.
• Strong collaboration is required with product engineers and probe engineers.

Requirements:

Successful candidates for this position will have:

• Ph.D or Master’s degree in Electrical engineering with focus on Semiconductor devices
• A strong understanding and experience with nonvolatile memories and in particular, NAND device physics.
• A strong understanding of semiconductor devices and processes.
• Experience with NAND cell trim and algo development is preferred.
• A strong understanding of statistics.
• Solid communication and reporting abilities.
• The ability to be highly skilled at driving for results.

Your responsibilities will include, but are not limited to, the following:

• Discover yield issues in NAND development and identify unique metric or combination of metrics, such as wafer/dice/tile shading, ECATS or other custom metric for issues quantification.
• Interact with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to drive clear definition of yield, cell, CMOS, qual, and reliability issues and pareto and derive improvement actions needed across tech-nodes and designs.
• Own and drive non-standard deep dive statistical analysis of inline, probe, cell, and other critical metrics to define issues/problems, enable early inline detection, and improve the product yield and quality. Quantify and track progress on the issue hit hate, line impact, gap to program goal. Quantify yield improvement/downside seen based on process/probe changes.
• Initiate data mining and correlation study on new issue seen. Initiate PFA request to identify root cause of yield issue. Perform inline correlation study to establish inline prediction to yield issue. Make yield projections based on expected improvement/downside. Conduct yield trend analysis, identify root causes in process step, conversion, algorithm change, and design, for yield shift.
• Continuously develop/re-define inline detection in collaboration with metrology and RDA team.
• Identify and define gaps with current test and co-develop (with product, probe, param engineering) unique parametric/probe bins to detect new fail modes as well as validate new program release.
• Collaborate with module owners to identify, quantify key module deficiencies/technology gaps, and drive cross-functional teams to address. Optimize existing layout, conceptualize, and develop innovative solutions to meet product requirements and manufacturability.
• Develop and innovate techniques in extracting data from different databases through various query languages and automate through scripting to improve work efficiency.
• Assist and support the transfer documentation of layout/architecture fundamentals of new technology from R&D to manufacturing fab.

Successful candidates for this position will have:

• Minimum of 3-5 years of experience in the semiconductor industry in the areas of Process Integration, Yield Enhancement, Failure Analysis, Data Science, or Unit Process.
• Ability to develop a strong holistic end to end understanding of PI module on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with nonvolatile memories along with good understanding of the process flow, interaction of process & device, common yield & reliability issues are desirable.
• Curiosity and natural tendency of learning new things independently.
• Exposure to R&D and transfer/manufacturing is desirable.
• Deep understanding of layout and architecture of NAND product.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection is desirable.
• Fluency in Python, JavaScript, C or C++ is desirable.
• Ability to be self-motivated and self-governing with proven ability to work in a demanding and dynamic environment.
• Ability to drive and coordinate cross-functional teams to achieve various goals.
• Solid analysis, communication and reporting abilities with demonstrated presentation abilities.
• Ability to travel for extended periods of time to the US or other fabs for collaborative R&D work.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Data Science, Computer Science or related field.

As a NAND CMOS Process Integration Engineer in the Singapore Technology Development department at Micron Technology Inc., you will be responsible for developing 3D NAND CMOS devices scaling and enhancing their performance, reliability and manufacturability.

Responsibilities:

• Develop and innovate critical CMOS Front end/interconnect module. Drive multi-functional teams to optimize existing process flows and develop new innovative solutions to meet product requirements and manufacturability.
• Develop/re-define critical specifications criteria for optimum product performance and drive activities to get them to manufacturing process capability.
• Extract and analyze inline, probe, parametric, reliability, and other critical metrics and predict future behavior of the CMOS device performance of the product to enable early innovative solutions to meet product and device specifications.
• Early introduction, characterization and validation of new CMOS device models and test structures for developing future NAND products.
• 3 dimensions analysis with the use of K2 view to extract layout information and combine with the doping profiles of each implant step for product development and integration solutions.
• Interact and collaborate with TCAD, modeling, and layout teams to drive clearer definition of CMOS device and reliability improvements across multiple tech-nodes and designs.
• Coordinate activities at manufacturing site towards gating experiment funding, conversions, and effectively communicate decisions made to all R&D, manufacturing, and relevant partners.
• Take on leadership role at quarterly yield summits and monthly program reviews in summarizing complex problems, deriving and explaining actions taken to address them and getting R&D, manufacturing, and senior management teams on the same page.
• Assist in the transfer of a new technology from R&D to manufacturing and contribute towards ensuring successful ramp and qualification. Supporting the transfer, documentation and training of module fundamentals into manufacturing.

Requirements:

• MS or PhD in Electrical Engineering preferably specialized in Microelectronics and Semiconductor Device Physics. Prior technology development and tech transfer/manufacturing experiences are preferred.
• Fresh MS/PhD candidates with knowledge of semiconductor process Integration, device physics and CMOS engineering.
• Direct fab experience with nonvolatile memories manufacturing, knowledge of TCAD, K2 view layout, and NAND product are highly desirable.
• Ability to develop a strong, holistic, end-to-end understanding of CMOS device and its related module on NAND technologies, related structural and electrical fail mechanisms.
• Deep understanding of probe failure mechanism, ability to do electrical bench data collection.
• Self-motivated, self-governing with proven ability to work in a demanding and dynamic environment.
• Experienced in coordinating cross-functional teams to achieve a goal.
• Solid data analysis, communication and reporting abilities with demonstrated presentation abilities.
• Curiosity and natural tendency of learning new things independently.
• Ability to travel for extended periods of time to the US for collaborative R&D work.

NTI NAND Senior/Principal Process Integration Engineer

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work

Prefered to have Skills / Experiences as below:

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Education:

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.

As a Product Engineer at Micron, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers. VPE is the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments.

You will have the opportunity to work on leading-edge and latest Non-Volatile Memory in the industry. In this role, you will have the chance to work and interact with cross-functional teams, learn more about NAND Flash, High Speed Capacity (HSC) & Solid State Drives (SSD), and will have exposure and holistic view of various aspects of product development, qualifications, ramping and testing at both frontend and backend.

Key Responsibilities :

• Work on NAND & HSC product development, focusing test coverage development and yield improvement.
• Carry out circuit simulation, wiki/macro development, engineering yield evaluation and data analysis, test calibration and validation for best-in-class quality / coverage and test time optimization.
• Perform in-depth electrical failure analysis to understand the root cause of the yield issues or NAND/HSC related failures.
• Work with system team to resolve NAND/HSC related issues during qualification and High-Volume Manufacturing (HVM) phase.
• Improve robustness of test coverage and screen development, leveraging on the vertical integrated model to maximize yield and quality.
• Utilize various engineering systems / platforms and state-of-art equipment to support product characterization and electrical failure analysis.

Requirements:

• Degree in Electrical and Electronics Engineering / Computer Engineering with at least 3 years of relevant experience in Semiconductor industry.
• Experience and knowledge of failure analysis methodologies.
• Strong drive and excellent written and verbal communication skills, including ability to effectively communicate complex technical ideas/concepts.
• Strong analytical and problem-solving skills, with the ability to find creative solutions to difficult problems.
• Knowledge of Complementary Metal Oxide Semiconductor (CMOS) device physics, & SSD is an added advantage.
• Knowledge of CMOS circuit design, CAD/Simulation and test flow and system architecture is an added advantage.
• Knowledge and experienced in component and system level testing, analysis and debugging is an added advantage.

As a Senior / Product Validation Engineer at Micron, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers.

Key Responsibilities :

• Perform firmware validation on SSD devices which include both new and sustaining devices with new Firmware revisions
• Define and create new validation test plan for new SSD products
• Conduct failure analysis of failures generated from validation run and collaborate with various SSD Development groups to resolve issues detected
• Maintain and enhance Validation coverage through regular reviews and feed forward paths to ensure optimum customer integration experience and customer qualification success of SSD products
• Communicate project status and report on a regular basis
• Work closely with Manufacturing, Operational and Development Groups to ensure a smooth collaboration and alignment among teams and deliver company roadmap SSD projects on schedule
• Provide support in the analysis and resolution of internal/external customer issues
• Develop test automation solutions to improve testability and execution efficiency

Requirements :

• Degree in Electrical and Electronics Engineering / Computer Engineering with at least 2 years of relevant experience
• Programming knowledge in Python and/or C++
• Knowledge of storage device drivers and SATA and/or PCIE chipset register configurations would be beneficial
• Relevant work experience in either SSD or HDD industry is an added adavantage
• Experience with SATA and/or NVMe storage interface protocols and Windows/Linux Operating Systems is an added advantage
• Ability to work independently with a minimum of day-to-day supervision
• Ability to work in a multi-functional team and under the pressure of multiple priorities