As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation manag...
As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technolo...
As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging techno...
Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.
Job Responsibilities
Provide leadership in wire bond technology, problem analysis and resolution
Develop and Transfer wire bond process for IC Package process technology (Wire Bon...
As a Manufacturing Engineer at MSB, you will be responsible for executing area resource plans in terms of logistics and indirect piece parts and managing, developing employee performance.
In this role some of the tasks that need to carried out include exploring continuous improvements activities to assist area management in running the production...
Job Description
As Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor pr...
Job Responsibilities:
Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area
- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
- Develop and engage creative solution for new equipment capabilities/ solution to iden...
As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope in Metro Real-time Defect Analysis (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will manage and optimi...
As Sr/Engineer for PDE Technology Development Process Integration, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To lead new Technode process readiness and improving the yield, quality...
Micron is seeking a highly motivated and experienced individual contributor to join our Assembly Package Technology Development (TD) team. As a Sr/Engineer in the Process Development team, you will play a crucial role in developing and qualifying new materials, equipment, and wafer tech nodes for Micron's world-class products and devices.
Primar...
Roles & responsibilities can include but are not limited to:
Test Product Process of Record (POR) SME:
Define the Business Process of Test Product Process and provide governance avenue.
Facilitate & lead the discussion of POR, Manufacturing Build of Material (mBOM) in Review Board for alignment and endorsement prior to release and depl...
Responsibilities and Tasks:
You will work regularly with Micron’s Business Units to ensure solutions meet or exceed business requirements. You will be expected to suggest, promote, and leverage published standards to minimize environment complexity and ensure regulatory as well as license compliance. You will have the opportunity to travel to other...
Responsibilities:
Design new test programs for 1st silicon validation of new product/technology startup which provides very important feedback for the appropriate groups responsible in refining the devices' quality and performance.
Develop and maintain test programs of Micron DRAM products to cater to customers' specifications, device performa...
We are seeking a motivated and meticulous EHS (Environmental, Health, and Safety) Engineer to join our team. This individual will primarily be overseeing chemical management, implementing the Live Safe program, and organizing EHS awareness campaigns. You should have a strong background in EHS regulations and best practices, with a focus on safety l...
Job Description
As an Assembly and Test Central Capacity Planning (ATCP) Engineer at Micron Technology, you will be in charge of PC DRAM component assembly network capacity
Key deliverables:
drive various capacity improvement activities to meet flexcap target
drive capacity related fill rate 100%,
network MSR capacity balance to make the bud...
Responsibilities will include, but are not limited to:
Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
Work closely with cross-functional team to address packaging design challenge in the area of layout, electrical, thermal, mechanical, assembly and reliability.
Interact with...
Enabling Program Management
Drive a suite of TD/Pre-NPI enabling projects that supports a program to ensure it's rolled out in accordance with the TD playbook and committed timelines.
Ensure business processes are followed.
Deliverables/artifacts from each TD phase are completed & documented.
Facilitate the TD Project Review, PMI Revi...
Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for BEOL area
Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
Develop and engage creative solution for new process, equipment capabilities and...
Responsibilities
Work with package design and development teams to complete chip package interaction risk assessment.
Work with scribe designers and assembly engineers to find solutions for dicing problems and implement relevant design rules and design FMEA.
Collaborate with R&D/manufacturing wafer fabs and packaging teams to solve relev...
Responsibilities
• Maintain equipment for SSD assembly processes
• Lead & manage shift technicians
• Spare management
• Lead Electrostatic Discharge (ESD) and chemical control for SSD production floor
• Safety representative for SSD Process and Equipment Engineering
• Ensure operation is in compliance with IATF/ISO requirements
• Support intern...
Equipment
Responsible for TEST TOR (Tool of Records) equipment sites' support, evaluation, trouble-shooting and installation
Fan out Best-Known Method to all sites in TOR procedures, deficiencies, and designs/implements improvements.
Work closely with process engineering and site’s equipment maintenance team to develop and support new proces...
As a Backend End Test Solutions Engineering Team Test Product Integration Engineer at Micron Technology, Inc., you will be responsible for leading multi-functional teams through the New Product Introduction (NPI) process. You will work closely with multiple Engineering teams throughout the company to ensure Product Integration execution, and produc...
Responsible the package design integration activities by working with cross-functional team and partners for package technology development, including material development, process development, DOEs, and related activities.
Work with a cross-functional team across several geographies to create package design databases such as package stack-up,...
Job Description
As a Non-Volatile Memory QRA (NVMQRA) Solid State Drive (SSD) Qual EFA Engineer at Micron Technology, Inc., you will be responsible for supporting electrical failure analysis from quality and reliability trials of Micron SSD products during product qualification. You will analyze the units that did not pass the required quality and...
As an Assembly and Test Central Capacity Planning (ATCP) Engineer at Micron Technology, you will be in charge of PC DRAM component assembly network capacity
Key deliverables:
drive various capacity improvement activities to meet flexcap target
drive capacity related fill rate 100%,
network MSR capacity balance to make the budget and network...